Microfabrication technologies for high aspect ratio processes.
نویسندگان
چکیده
منابع مشابه
Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques
The emphasis on high aspect ratio micromachining techniques for microsystems/MEMS has been mainly to achieve novel devices with, for example, high sensing or actuation performance. Often these utilize deep structures (100–1,000 lm) with vertical wall layers but with relatively modest spatial resolution (1–10 lm). As these techniques move from research to industrial manufacture, the capital cost...
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Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1987
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.53.1687